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Quality (N,N-DIMETHYLAMINO)DIMETHYLSILANE (CAS NO. 22705-32-4) factory
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Quality (N,N-DIMETHYLAMINO)DIMETHYLSILANE (CAS NO. 22705-32-4) factory
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(N,N-DIMETHYLAMINO)DIMETHYLSILANE (CAS NO. 22705-32-4)

Specifications
Highlight:

MW 103.24 (n n-dimethylamino)dimethylsilane

,

(n n-dimethylamino)dimethylsilane

,

22705-32-4 cas
Product Name:
(n,n-dimethylamino)dimethylsilane
Appearance:
Clear Liquid
MF:
C4H13NSi
MW:
103.24
M.P:
<0°C
B.P:
67 °C
Density:
0,726 G/cm3
Flash point:
-13°C
Tags:

ethyltrimethoxysilane

methylsilane

silane
Key Attributes
Brand Name: SISO
Model Number: 22705-32-4
Place of Origin: China
Payment Terms: T/T
Product Description

1. High-efficiency Siliconization & Silylation Reagent 

As a highly active amino silane reagent, it contains reactive dimethylamino silyl functional groups, which can efficiently react with active hydrogen groups such as hydroxyl and carboxyl. It is widely used for silylation modification of organic compounds, polymer materials and inorganic substrate surfaces, effectively reducing surface polarity and improving chemical stability and hydrophobicity of materials.

2. Polymer Cross-linking & Curing Accelerator 

It can serve as an efficient cross-linking agent and curing promoter for silicone resins, polyurethane and epoxy polymer systems. The active silyl group can initiate cross-linking reaction to form stable Si-O cross-linked networks, significantly improving curing efficiency, cross-linking density, mechanical strength and solvent resistance of polymer materials.

3. Inorganic-organic Interface Coupling Modifier 

This product has excellent interface bonding performance. It can realize chemical bonding between organic polymer matrix and inorganic fillers such as silica, glass and metal oxides, optimize interface compatibility, eliminate interfacial defects, and greatly enhance the bonding strength, weather resistance and structural stability of composite materials.

4. Electronic Grade Surface Passivation & Protection Agent

Featuring low impurity content, high chemical activity and excellent film-forming property, it is suitable for surface passivation and insulation protection of semiconductor chips and precision electronic components. It can form a dense hydrophobic protective film on the material surface, effectively isolating moisture and impurities, and improving the insulation performance and long-term service reliability of electronic devices.
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