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Quality 3-(ETHOXYDIMETHYLSILYL)PROPAN-1-AMINE (CAS NO. 18306-79-1) factory
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Quality 3-(ETHOXYDIMETHYLSILYL)PROPAN-1-AMINE (CAS NO. 18306-79-1) factory
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3-(ETHOXYDIMETHYLSILYL)PROPAN-1-AMINE (CAS NO. 18306-79-1)

Specifications
Highlight:

0.857g/mL 3-(ethoxydimethylsilyl)propan-1-amine

,

C7H19NOSi 3-(ethoxydimethylsilyl)propan-1-amine

,

cas no. 18306-79-1

Product Name:
3-(Ethoxydimethylsilyl)propan-1-amine
Appearance:
Clear Liquid
MF:
C7H19NOSi
MW:
161.32
M.P:
<0°C
B.P.:
60 °C8 Mm Hg(lit.)
Density:
0.857 G/mL At 25 °C(lit.)
Flash point:
136 °F
Key Attributes
Brand Name: SISO
Model Number: 18306-79-1
Place of Origin: China
Payment Terms: T/T
Product Description

1. High-performance Organic-inorganic Coupling Agent

This product is a bifunctional organosilane containing hydrolyzable ethoxy silyl group and active amino group. It can undergo hydrolysis and condensation reaction with hydroxyl groups on the surface of inorganic substrates such as glass, silica and metal oxides, and form chemical bonding with organic polymer matrices. It effectively optimizes interfacial compatibility and improves the comprehensive performance of composite materials.

2. Modified Precursor for Silicone Functional Polymers

As a key amino-functional silane monomer, it can be used for the modification and copolymerization of epoxy, polyurethane and acrylic resin systems. The introduced aminoalkyl siloxane segments can significantly enhance the flexibility, adhesion, thermal stability and chemical corrosion resistance of polymer materials.

3. High-adhesion Industrial Coating Additive 

It serves as an excellent adhesion promoter and curing auxiliary agent for industrial anti-corrosion coatings, architectural coatings and adhesive systems. The dual reactive structures can strengthen the bonding force between coating film and various substrates, solve the problem of poor adhesion of traditional coatings, and improve coating durability, water resistance and weather resistance.

4. Surface Modifier for Electronic & Precision Materials

With low impurity content, stable chemical properties and excellent film-forming ability, it is applicable to surface modification and insulation treatment of electronic fillers and precision electronic components. It can form a uniform protective film on material surfaces, effectively improving moisture resistance, insulation performance and surface smoothness of electronic materials.
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