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Quality BIS(METHYLDIMETHOXYSILY)METHANE(CAS NO. 18297-79-5) factory
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Quality BIS(METHYLDIMETHOXYSILY)METHANE(CAS NO. 18297-79-5) factory
Quality BIS(METHYLDIMETHOXYSILY)METHANE(CAS NO. 18297-79-5) factory
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BIS(METHYLDIMETHOXYSILY)METHANE(CAS NO. 18297-79-5)

Specifications
Highlight:

0.9679g/cm3 Alkoxy Silane

,

High density bis(methyldimethoxysily)methane

,

cas no. 18297-79-5
Product Name:
Bis(methyldimethoxysily)methane
Appearance:
Clear Liquid
MF:
C7H20O4Si2
MW:
224.4
M.P:
<0°C
B.P:
184°C
Density:
0.9679 G/cm3
Flash point:
No Data Available
Tags:

Alkoxy Silane

bismethane

methylsilane
Key Attributes
Brand Name: SISO
Model Number: 18297-79-5
Place of Origin: China
Payment Terms: T/T
Product Description

1. High-efficiency Organic-inorganic Interface Coupling Agent 

This product is a high-activity bifunctional alkoxysilane cross-linking monomer with dual methoxysilyl reactive groups. It can undergo uniform hydrolysis and condensation reaction with hydroxyl groups on the surface of inorganic substrates such as glass, silica and metal oxides. It builds stable chemical bridging bonds between inorganic fillers and organic polymer matrices, significantly optimizing interfacial compatibility and improving the overall mechanical properties and bonding durability of composite materials.

2. High-density Cross-linked Silicone Polymer Precursor 

The unique methane-bridged dual-silicon structure enables uniform and controllable cross-linking reaction during polymerization. It can be copolymerized with conventional silicone and acrylic monomers to form high-density and high-stability cross-linked network structures, effectively improving the structural compactness, solvent resistance and thermal stability of polymer materials.

3. High-adhesion Coating & Adhesive Modifier

Serving as an excellent adhesion promoter and curing auxiliary agent for industrial coatings, sealants and polymer adhesives, it can significantly enhance the interfacial bonding force between coating or adhesive layers and metal, plastic, glass and other substrates. It solves the problem of poor adhesion of traditional systems, and improves the water resistance, weather resistance and peeling strength of coating and adhesive products.

4. Electronic Insulation & Moisture-proof Functional Additive

With low impurity content, stable chemical properties and excellent film-forming performance, it is widely used in electronic insulation materials and precision electronic packaging systems. After curing, it forms a dense hydrophobic insulating film, which can effectively block moisture and gas penetration, reduce dielectric loss, and enhance the long-term insulation stability and environmental adaptability of electronic devices.
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