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BIS(TRIETHOXYSILYL)METHANE(CAS NO. 18418-72-9)
Specifications
Highlight:
C13H32O6Si2 Alkoxy Silane
,MW340.56 bis(triethoxysilyl)methane
,cas 18418-72-9
Product Name:
Bis(triethoxysilyl)methane
Appearance:
Clear Liquid
MF:
C13H32O6Si2
MW:
340.56
M.P:
<0°C
B.P:
114 °C
Density:
0.974
Flash point:
>65°C
Key Attributes
Brand Name:
SISO
Model Number:
18418-72-9
Place of Origin:
China
Payment Terms:
T/T
Product Description
1. High-efficiency Bifunctional Silane Coupling Agent
This product is a high-activity bifunctional ethoxysilane monomer with a unique methane-bridged double silicon structure and six hydrolyzable ethoxy groups. It can undergo efficient hydrolysis and condensation reaction with hydroxyl groups on the surface of inorganic substrates such as glass, silica, metal oxides and fillers. It builds stable chemical bridging structures between inorganic phases and organic polymer matrices, effectively optimizing interfacial compatibility and significantly improving the bonding strength and overall mechanical properties of composite materials.
2. High-crosslinking Silicone Polymer Synthetic Precursor
Benefiting from the multi-functional hydrolytic active sites and rigid short-bridge molecular structure, it can be used as a key cross-linking monomer for silicone resin and modified polymer synthesis. It realizes uniform and controllable cross-linking and curing reactions, forms high-density and high-stability three-dimensional network structures, and effectively enhances the structural compactness, solvent resistance and thermal stability of polymer materials.
3. High-durability Coating & Adhesive Reinforcing Modifier
It serves as an excellent adhesion promoter and curing enhancer for industrial anti-corrosion coatings, weather-resistant coatings, sealants and polymer adhesives. It can significantly improve the interfacial bonding force between coatings, adhesives and various substrates, effectively solving the problems of poor adhesion and easy peeling of traditional systems, and improving the water resistance, weather resistance and structural durability of coating and adhesive layers.
4. Electronic Insulation & High-barrier Packaging Materials
With ultra-low impurity content, stable chemical properties and excellent cross-linking film-forming ability, it is suitable for modifying electronic insulation and packaging materials. After curing, it forms a dense, low-polarity and high-barrier insulating film, which can effectively block moisture and oxygen penetration, reduce dielectric loss, and improve the long-term insulation reliability and environmental adaptability of precision electronic devices.
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